SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X
  • Selleritchi.eu
  • List PriceUS$9.17piece
  • Sale PriceUS$9.17piece
  • ShippingFree Shipping
  • Ratings4,9 (562)

Product Description

Features:

High density, high impedance
Pure alloy compositin
Fine and sticky
Stannum planting, not bubbing
Silver containing highlight
Model: SP-X
Weight: 50g
Size: 38 x 31 x 35mm
Melting Point: 158℃

Package Included:

1 x
SP-X Middle Layer of BGA Motherboard Special Solder Paste

Detail Pictures:

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X

SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X